Optimization of Gate-All-Around Device to Achieve High Performance and Low Power with Low Substrate Leakage.

In this study on multi-nanosheet field-effect transistor (mNS-FET)-one of the gate-all-around FETs (GAAFET) in the 3 nm technology node dimension-3D TCAD (technology computer-aided design) was used to attain optimally reduced substrate leakage from options including a punch-through-stopper (PTS) doping scheme and a bottom oxide (BO) scheme for bottom isolation, with the performance improvement being shown in the circuit-level dynamic operation using the mNS-FET. The PTS doping concentration requires a high value of >5 × 10 cm to reduce gate induced drain leakage (GIDL), regardless of the presence or absence of the bottom isolation layer. When the bottom isolation is applied together with the PTS doping scheme, the capacitance reduction is larger than the on-state current reduction, as compared to when only the PTS doping concentration is applied.