First principles modeling of mechanical properties of binary alloys containing Ga, Sn, and In for soldering applications.

Using density functional theory, the elastic properties of various binary Ga, Sn, and In-based alloys have been calculated to determine their viability as potential replacements for toxic Pb-based solders. Computed quantities such as the bulk, shear, and Young'smoduli were used to evaluate the mechanical behavior of the studied materials. The Pugh ratioand Poisson's ratiowere utilized to quantify the ductility of the alloys.