Publications by authors named "Silvia Gomez-Barreiro"

The analysis of thermal processes associated to the curing of adhesives and the study of mechanical behavior once cured, provide key information to choose the best option for any specific application. The proposed methodology for the curing characterization, based on thermal analysis and rheology, is described through the comparison of three commercial adhesives. The experimental techniques used here are Thermogravimetric Analysis (TGA), Differential Scanning Calorimetry (DSC) and Rheology.

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