Publications by authors named "Shunchang Hu"
Article Synopsis
- E-waste, particularly waste-printed circuit boards (WPCBs), poses environmental and health risks due to harmful materials like copper, gold, and lead present in high concentrations.
- Recent research emphasizes the eco-friendly and cost-effective biorecovery methods, specifically bioleaching and biosorption, for extracting metals from WPCBs.
- The study reviews the principles and efficiency of these methods, discusses factors affecting recovery, and explores hybrid strategies for improved selective metal recovery, while considering future advancements in this field.
Thermal Bending Simulation and Experimental Study of 3D Ultra-Thin Glass Components for Smartwatches.
Micromachines (Basel)
October 2024
The heating system is an essential component of the glass molding process. It is responsible for heating the glass to an appropriate temperature, allowing it to soften and be easily molded. However, the energy consumption of the heating system becomes particularly significant in large-scale production.
View Article and Find Full Text PDFPrecision processing of monocrystalline silicon presents significant challenges due to its unique crystal structure and chemical properties. Effective modeling and simulation are essential for advancing the understanding of the manufacturing process, optimizing design, and refining production parameters to enhance product quality and performance. This review provides a comprehensive analysis of the modeling and simulation techniques applied in the precision machining of monocrystalline silicon using diamond wire sawing.
View Article and Find Full Text PDFIn recent years, infrared thermographic (IRT) technology has experienced notable advancements and found widespread applications in various fields, such as renewable industry, electronic industry, construction, aviation, and healthcare. IRT technology is used for defect detection due to its non-contact, efficient, and high-resolution methods, which enhance product quality and reliability. This review offers an overview of active IRT principles.
View Article and Find Full Text PDFArticle Synopsis
- The study addresses the low yield rate of large, irregular glass components in vehicles caused by stress and dimension deviations during glass molding.
- A numerical model was created to analyze molding quality factors, particularly focusing on the impact of molding temperature and pressure on energy consumption and dimensional accuracy.
- The optimization algorithm NSGA-II identified the best molding conditions, which were experimentally verified to have a predictive error under 20%, confirming the model's effectiveness for future precision molding applications.
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon.
Micromachines (Basel)
July 2023
Article Synopsis
- Diamond wire sawing (DWS) is essential for cutting brittle silicon wafers in solar cell production, and understanding cutting parameters is key to improving production yield.
- Various methods like mathematical models, molecular dynamics, and finite element analysis are compared to study the principles of DWS and its effect on material removal rate (MRR) as well as surface quality of silicon wafers.
- The research also examines advanced assisted machining methods (ultrasonic, electrical discharge, and electrochemical) and discusses their processing performance, while outlining future opportunities for enhancing DWS technology in precision silicon machining.