Research on the thermal conductivity and dielectric properties of AlN and BN co-filled addition-cure liquid silicone rubber composites.

The present work aims at studying the thermal and dielectric properties of addition-cure liquid silicone rubber (ALSR) matrix composites using boron nitride (BN) and aluminum nitride (AlN) as a hybrid thermal conductive filler. Composite samples with different filler contents were fabricated, and the density, thermal conductivity, thermal stability, dielectric properties, and volume resistivity of the samples were measured. According to the experimental results, the density, thermal conductivity, dielectric constant and dielectric loss tangent values all increased with the increasing addition of filler.