Etching Rate Analysis Model Based on Quartz Bond Angle Characteristics.

This paper proposes a method for classifying crystal planes based on the bond angle characteristics of quartz unit cells and constructs an etch rate model for quartz crystal planes at both macro and micro scales. By omitting oxygen atoms from the quartz cell structure, a method based on bond angle characteristics was established to partition the atomic arrangement of the crystal surface. This approach was used to analyze the etching processes of typical quartz crystal planes (R, r, m, and (0001)), approximating the etching process of crystals as a cyclic removal of certain bond angle characteristics on the crystal planes.