With the continuous development of modern optical systems, the demand for full spatial frequency errors of optical components in the system is increasing. Although computer-controlled sub-aperture polishing technology can quickly correct low-frequency errors, this technology significantly worsens the mid-frequency errors on the surface of the component, which greatly inhibits the improvement of optical system performance. Therefore, we conducted in-depth research on the non-stationary effect of the removal function caused by the fluctuation in magnetorheological polishing and their influence on the mid-frequency errors of the component surface.
View Article and Find Full Text PDFIn view of the problems of large surface roughness and low removal efficiency caused by the existing sapphire processing process, a combined polishing process based on temperature control computer controlled optical surfacing-magnetic rheology is proposed. The polishing removal mechanism of sapphire material polishing and the law of processing surface roughness change are studied. The optimal process parameters are obtained by designing the orthogonal experiments.
View Article and Find Full Text PDFAs a key component of a high-power laser device, fused silica optics needs to bear great laser energy, and laser damage is easily generated on the optical surface. In order to improve the service life and availability of optics, it is necessary to repair the damaged optics. In this work, the repair technique of damaged, fused silica optics was studied.
View Article and Find Full Text PDFThe continuous phase plate (CPP) provides excellent beam smoothing and shaping impacts in the inertial confinement fusion application. However, due to the features of its dispersion, its surface gradient is frequently too large (>2 μm/cm) to process. When machining a large gradient surface with continuous ion beam figuring (IBF), the acceleration of the machine motion axis cannot fulfill the appropriate requirements, and the machining efficiency is further influenced by the unavoidable extra removal layer.
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