Electroless Nickel Deposition for Front Side Metallization of Silicon Solar Cells.

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni₂Si and NiSi in samples annealed at 300-800 °C.

Structural Stability of Diffusion Barriers in Cu/Ru/MgO/Ta/Si.

Various structures of Cu (50 nm)/Ru (2 nm)/MgO (0.5-3 nm)/Ta (2 nm)/Si were prepared by sputtering and electroplating techniques, in which the ultra-thin trilayer of Ru (2 nm)/MgO (0.5-3 nm)/Ta (2 nm) is used as the diffusion barrier against the interdiffusion between Cu film and Si substrate.

Structures and magnetic properties of electroless Ni multilayers on Fe/Si substrate.

Nanosized single and multiple layers of electroless Ni films were deposited on Fe film. The multilayer films consisting of a Fe/(Ni1 Ni2)n structure, where Ni1 and Ni2 denote various electroless Ni films deposited in plating baths with different pH values, and n denotes layer numbers and equals to 2, 4, 8, and 16, were formed by alternately changing the pH value of plating baths under controlled deposition time during the deposition process. The ensuing results showed that the boundaries between films are almost even.