Advances in machine learning methods in copper alloys: a review.

Context: Advanced copper and copper alloys, as significant engineering structural materials, have recently been extensively used in energy, electron, transportation, and aviation domains. Higher requirements urge the emergence of high-performance copper alloys. However, the traditional trial-and-error experimental observations and computational simulation research used to design and develop novel materials are time-consuming and costly.

The loading speed facilitating stress relaxation behaviors of surface-modified silicon: a molecular dynamics study.

Time-dependent plastic deformation commonly exists in silicon-based microelectronic contact. The stress relaxation behaviors of SiO/Si bilayer composite are studied using molecular dynamics simulation by varying loading speed. The results imply that the indentation force decreases sharply at the initial and linearly towards the end of holding, and the amount of stress relaxation increases with the increasing loading speed.