In recent years, significant advancements in printed electronics and flexible materials have catalyzed the development of electronic skins for wearable applications. However, the low glass transition temperature of flexible substrates poses a challenge as it is incompatible with the high-temperature annealing required for electrode fabrication, thereby limiting the performance of flexible electronic devices. In this study, we address these limitations by proposing a novel flexible device manufacturing process that combines adhesive printing patterning with a transfer printing technology.
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