Publications by authors named "Shizhou Jiang"
Grain-boundary engineering is an effective strategy to tune the thermal conductivity of materials, leading to improved performance in thermoelectric, thermal-barrier coatings, and thermal management applications. Despite the central importance to thermal transport, a clear understanding of how grain boundaries modulate the microscale heat flow is missing, owing to the scarcity of local investigations. Here, thermal imaging of individual grain boundaries is demonstrated in thermoelectric SnTe via spatially resolved frequency-domain thermoreflectance.
View Article and Find Full Text PDFTwo-dimensional (2D) semiconductors exhibit unique physical properties at the limit of a few atomic layers that are desirable for optoelectronic, spintronic, and electronic applications. Some of these materials require ambient encapsulation to preserve their properties from environmental degradation. While encapsulating 2D semiconductors is essential to device functionality, they also impact heat management due to the reduced thermal conductivity of the 2D material.
View Article and Find Full Text PDFArticle Synopsis
- - Two-dimensional transition metal halides, like CrI, have interesting magnetic properties, but they deteriorate quickly in regular environments, making research and practical use challenging.
- - Researchers managed to improve the long-term stability of CrI by using an organic buffer layer (PTCDA) before applying alumina through a method called atomic layer deposition (ALD), preventing harmful chemical reactions.
- - This new setup not only maintains CrI's magnetic qualities down to a single layer but also enables the development of electronic devices like field-effect transistors and photodetectors, and allows for thermal conductivity analysis.