Curing Kinetics and Mechanical Properties of Epoxy-Cyanate Ester Composite Films for Microelectronic Applications.

In general, although abundant literature studies are available on epoxy resin systems, a complete description of the curing kinetics in epoxy-cyanate ester composites relevant to the microelectronics industry is still lacking. Herein, curing behaviors of Ajinomoto build-up films, which are epoxy/silica composites, were studied by the non-isothermal differential scanning calorimetry method, and then, three non-isothermal curing kinetics models and model-free curing methods were used to analyze curing behaviors. In addition, a copper layer was also deposited onto the surface of the build-up film, and its interfacial adhesion property was also analyzed at different pre-curing conditions.

Study on curing kinetics and behaviours of PGN adhesives.

The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages.

Rationally Constructed Surface Energy and Dynamic Hard Domains Balance Mechanical Strength and Self-Healing Efficiency of Energetic Linear Polymer Materials.

Polymeric materials that simultaneously possess excellent mechanical properties and high self-healing ability at room temperature, convenient healing, and facile fabrication are always a huge challenge. Herein, we report on surface-energy-driven self-healing energetic linear polyurethane elastomers (EPU) that were facilely fabricated by two-step methods to acquire high healing efficiency and mechanical properties. By constructing surface energy and dynamic hard domains, energetic linear polyurethane elastomers not only obtained high healing ability and mechanical properties at high or room temperature but also avoid the use of some assisted healing conditions and complex chemical structure design and decrease manufacturing difficulty.