Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation.

This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion between the thin metal film and polyimide substrate. Compared with the previous fabrication of a cylindrical thin-film wrinkling pattern, an undulated wrinkling pattern has been implemented by increasing the width of the thin metal film in order to create biaxial straining in the thin film.

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation.

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change.

Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit boards (PCBs) encapsulated in a biocompatible polymer material, with input/output feedthroughs for electrical interconnections. The feedthroughs are regarded as essential elements of the reliability of the package since they create inevitable interfaces with the encapsulation materials.

Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration".

As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...

A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation.

This paper proposed and verified the use of polymer-based packaging to implement the chronic implantation of neural interfaces using a combination of a commercial thermal epoxy and a thin parylene film. The packaging's characteristics and the performance of the vulnerable interface between the thermal epoxy layer and polyimide layer, which is mainly used for neural electrodes and an FPCB, were evaluated through in vitro, in vivo, and acceleration experiments. The performance of neural interfaces-composed of the combination of the thermal epoxy and thin parylene film deposition as encapsulation packaging-was evaluated by using signal acquisition experiments based on artificial stimulation signal transmissions through in vitro and in vivo experiments.

Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation.

Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC).

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe.

This paper presents measurement and FEM (Finite Element Method) analysis of metal adhesion force to a parylene substrate for implantable neural probe. A test device composed of 300 nm-thick gold and 30 nm-thick titanium metal electrodes on top of parylene substrate was prepared. The metal electrodes suffer from delamination during wet metal patterning process; thus, CF plasma treatment was applied to the parylene substrate before metal deposition.

Ultralow-phase-noise oscillators based on BAW resonators.

This paper presents two 2.1-GHz low-phase noise oscillators based on BAW resonators. Both a single-ended common base structure and a differential Colpitts structure have been implemented in a 0.