Publications by authors named "Sebastian Randel"

Coherent reception, along with time- and wavelength-division multiplexing (TWDM), is a promising concept to simultaneously support multiple services in future high-speed point-to-multipoint passive optical networks (PONs). The next-generation PON 2 (NG-PON2) standard describes a TWDM-PON based on IM/DD intensity modulation and direct detection (IM/DD) which employs tunable-lasers and optical filters such as tunable optical filters or cyclic arrayed-waveguide gratings. Here, we investigate what we believe to be a novel coherent TWDM-PON architecture based on a frequency comb source in the optical line terminal (OLT), and thermally-tuned distributed-feedback (DFB) lasers in the optical network units (ONUs).

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Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodiodes (PD) still represents a challenge. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) offer an attractive path for connecting multimode fiber arrays as well as individual cores of multimode multicore fibers to standard arrays of VCSEL or PD.

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We demonstrate an optical phased-array equipped with a 3D-printed facet-attached element for shaping and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on-chip waveguide structures. In a proof-of-concept experiment, we achieve a grating-lobe free steering range of ±30 and a full-width-half-maximum beam divergence of approximately 2.

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Laser-based light detection and ranging (LiDAR) is key to many applications in science and industry. For many use cases, compactness and power efficiency are key, especially in high-volume applications such as industrial sensing, navigation of autonomous objects, or digitization of 3D scenes using hand-held devices. In this context, comb-based ranging systems are of particular interest, combining high accuracy with high measurement speed.

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Combining semiconductor optical amplifiers (SOA) on direct-bandgap III-V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrication of such devices still relies on technologically demanding monolithic integration of heterogeneous material systems or requires costly high-precision package-level assembly, often based on active alignment, to achieve low-loss coupling between the SOA and the external feedback circuits. In this paper, we demonstrate a novel class of hybrid ECL that overcome these limitations by exploiting 3D-printed photonic wire bonds as intra-cavity coupling elements.

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We report on compact and efficient silicon-organic hybrid (SOH) Mach-Zehnder modulators (MZM) with low phase-shifter insertion loss of 0.7 dB. The 280 µm-long phase shifters feature a -voltage-length product of 0.

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Chip-scale frequency comb generators lend themselves as multi-wavelength light sources in highly scalable wavelength-division multiplexing (WDM) transmitters and coherent receivers. Among different options, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out due to their compactness and simple operation along with the ability to provide a flat and broadband comb spectrum with dozens of equally spaced optical tones. However, the devices suffer from strong phase noise, which impairs transmission performance of coherent links, in particular when higher-order modulation formats are to be used.

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We formulate and experimentally validate an equivalent-circuit model based on distributed elements to describe the electric and electro-optic (EO) properties of travelling-wave silicon-organic hybrid (SOH) slot-waveguide modulators. The model allows to reliably predict the small-signal EO frequency response of the modulators exploiting purely electrical measurements of the frequency-dependent RF transmission characteristics. We experimentally verify the validity of our model, and we formulate design guidelines for an optimum trade-off between optical loss due to free-carrier absorption (FCA), electro-optic bandwidth, and π-voltage of SOH slot-waveguide modulators.

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Optical frequency combs have the potential to become key building blocks of wavelength-division multiplexing (WDM) communication systems. The strictly equidistant narrow-band spectral lines of a frequency comb can serve either as carriers for parallel WDM transmission or as local-oscillator (LO) tones for parallel coherent reception. When it comes to highly scalable WDM transceivers with compact form factor, chip-sale comb sources are of particular interest, and recent experiments have demonstrated the viability of such devices for high-speed communications with line rates of tens of Tbit/s.

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Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements.

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Quantum-dash (QD) mode-locked laser diodes (MLLD) lend themselves as chip-scale frequency comb generators for highly scalable wavelength-division multiplexing (WDM) links in future data-center, campus-area, or metropolitan networks. Driven by a simple DC current, the devices generate flat broadband frequency combs, containing tens of equidistant optical tones with line spacings of tens of GHz. Here we show that QD-MLLDs can not only be used as multi-wavelength light sources at a WDM transmitter, but also as multi-wavelength local oscillators (LO) for parallel coherent reception.

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Chip-scale frequency comb generators have the potential to become key building blocks of compact wavelength-division multiplexing (WDM) transceivers in future metropolitan or campus-area networks. Among the various comb generator concepts, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out as a particularly promising option, combining small footprint with simple operation by a DC current and offering flat broadband comb spectra. However, the data transmission performance achieved with QD-MLLD was so far limited by strong phase noise of the individual comb tones, restricting experiments to rather simple modulation formats such as quadrature phase shift keying (QPSK) or requiring hardware-based compensation schemes.

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Complex photonic-integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that relies on 3D-printed freeform waveguide overpasses (WOP).

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Silicon-organic hybrid (SOH) electro-optic (EO) modulators combine small footprint with low operating voltage and hence low power dissipation, thus lending themselves to on-chip integration of large-scale device arrays. Here we demonstrate an electrical packaging concept that enables high-density radio-frequency (RF) interfaces between on-chip SOH devices and external circuits. The concept combines high-resolution AlO printed-circuit boards with technically simple metal wire bonds and is amenable to packaging of device arrays with small on-chip bond pad pitches.

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We report on the first demonstration of long-term thermally stable silicon-organic hybrid (SOH) modulators in accordance with Telcordia standards for high-temperature storage. The devices rely on an organic electro-optic sidechain polymer with a high glass transition temperature of 172 °C. In our high-temperature storage experiments at 85 °C, we find that the electro-optic activity converges to a constant long-term stable level after an initial decay.

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Electro-optic modulators for high-speed on-off keying (OOK) are key components of short- and medium-reach interconnects in data-center networks. Small footprint, cost-efficient large-scale production, small drive voltages and ultra-low power consumption are of paramount importance for such devices. Here we demonstrate that the concept of silicon-organic hybrid (SOH) integration perfectly meets these challenges.

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We demonstrate fiber nonlinearity mitigation by using multiple optical phase conjugations (OPCs) in the WDM transmission systems of both 8 × 32-Gbaud PDM QPSK channels and 8 × 32-Gbaud PDM 16-QAM channels, showing improved performance over a single mid-span OPC and no OPC in terms of nonlinear threshold and a best achievable Q factor after transmission. In addition, after an even number of OPCs, the signal wavelength can be preserved after transmission. The performance of multiple OPCs for fiber nonlinearity mitigation was evaluated independently for WDM PDM QPSK signals and WDM PDM 16-QAM signals.

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High-speed interconnects in data-center and campus-area networks crucially rely on efficient and technically simple transmission techniques that use intensity modulation and direct detection (IM/DD) to bridge distances of up to a few kilometers. This requires electro-optic modulators that combine low operation voltages with large modulation bandwidth and that can be operated at high symbol rates using integrated drive circuits. Here we explore the potential of silicon-organic hybrid (SOH) Mach-Zehnder modulators (MZM) for generating high-speed IM/DD signals at line rates of up to 120 Gbit/s.

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Mode-division multiplexing over 33-km few-mode fiber is investigated. It is shown that 6×6 MIMO processing can be used to almost completely compensate for crosstalk and intersymbol interference due to mode coupling in a system that transmits uncorrelated 28-GBaud QPSK signals on the six spatial and polarization modes supported by a novel few-mode fiber.

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