A Gradient Stiffness-Programmed Circuit Board by Spatially Controlled Phase-Transition of Supercooled Hydrogel for Stretchable Electronics Integration.

Due to emerging demands in soft electronics, there is an increasing need for material architectures that support robust interfacing between soft substrates, stretchable electrical interconnects, and embedded rigid microelectronics chips. Though researchers have adopted rigid-island structures to solve the issue, this approach merely shifts stress concentrations from chip-conductor interfaces to rigid-island-soft region interfaces in the substrate. Here, a gradient stiffness-programmed circuit board (GS-PCB) that possesses high stretchability and stability with surface mounted chips is introduced.

Strain-Insensitive Outdoor Wearable Electronics by Thermally Robust Nanofibrous Radiative Cooler.

Stable outdoor wearable electronics are gaining attention due to challenges in sustaining consistent device performance outdoors, where sunlight exposure and user movement can disrupt operations. Currently, researchers have focused on integrating radiative coolers into wearable devices for outdoor thermal management. However, these approaches often rely on heat-vulnerable thermoplastic polymers for radiative coolers and strain-susceptible conductors that are unsuitable for wearable electronics.