Interlayer exchange couple based reliable and robust 3-input adder design methodology.

In this paper, a novel inter-layer exchange coupled (IEC) based 3-input full adder design methodology is proposed and subsequently the architecture has been implemented on the widely accepted micromagnetic OOMMF platform. The impact of temperature on the IEC coupled full-adder design has been analyzed up to Curie temperature. It was observed that even up to Curie temperature the IEC based adder design was able to operate at sub-50 nm as contrast to dipole coupled adder design which failed at 5 K for sub 50 nm.

A novel and reliable interlayer exchange coupled nanomagnetic universal logic gate design.

In this paper, we propose an interlayer exchange coupling (IEC) based 3D universal NAND/NOR gate design methodology for the reliable and robust implementation of nanomagnetic logic design as compared to the state-of-the art architectures. Owing to stronger coupling scheme as compared to the conventional dipole coupling, the random flip of the states of the nanomagnets (i.e.

Temperature and Size Effect on the Electrical Properties of Monolayer Graphene based Interconnects for Next Generation MQCA based Nanoelectronics.

Graphene interconnects have been projected to out-perform Copper interconnects in the next generation Magnetic Quantum-dot Cellular Automata (MQCA) based nano-electronic applications. In this paper a simple two-step lithography process for patterning CVD monolayer graphene on SiO/Si substrate has been used that resulted in the current density of one order higher magnitude as compared to the state-of-the-art graphene-based interconnects. Electrical performances of the fabricated graphene interconnects were evaluated, and the impact of temperature and size on the current density and reliability was investigated.