Thermal atomic layer etching (ALE) is an emerging technique that involves the sequential removal of monolayers of a film by alternating self-limiting reactions, some of which generate volatile products. Although traditional ALE processes rely on the use of plasma, several thermal ALE processes have recently been developed using hydrogen fluoride (HF) with precursors such as trimethylaluminum (TMA) or tin acetylacetonate. While HF is currently the most effective reagent for ALE, its potential hazards and corrosive nature have motivated searches for alternative chemicals.
View Article and Find Full Text PDFUsing wet-chemical self-assembly, we demonstrate that standard surface reactions can be markedly altered. Although HF etching of Si surfaces is known to produce H-terminated surfaces, we show that up to approximately 30% of a monolayer of stable Si-F bonds can be formed on atomically smooth Si(111) surfaces on HF reaction, when chemically isolated Si atoms are the target of the reaction. Similarly, approximately 30% Si-OH termination can be achieved by immersion of the partially covered F-Si(111) surface in water without oxidation of the underlying Si substrate.
View Article and Find Full Text PDFParameters important to the self-assembly of 3-(aminopropyl)triethoxysilane (APTES) on chemically grown silicon oxide (SiO 2) to form an aminopropyl silane (APS) film have been investigated using in situ infrared (IR) absorption spectroscopy. Preannealing to approximately 70 degrees C produces significant improvements in the quality of the film: the APS film is denser, and the Si-O-Si bonds between the molecules and the SiO 2 surface are more structured and ordered with only a limited number of remaining unreacted ethoxy groups. In contrast, post-annealing the functionalized SiO 2 samples after room temperature reaction with APTES (i.
View Article and Find Full Text PDFA tethered ethylenebis(indenyl) zirconocene was covalently immobilized on H-terminated Si(111) surfaces using UV-mediated alkene hydrosilylation, thus making possible the development of structured catalytic surfaces with highly controlled properties.
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