Nano Groove and Prism-Structured Triboelectric Nanogenerators.

Enhancing the output power of triboelectric nanogenerators (TENGs) requires the creation of micro or nano-features on polymeric triboelectric surfaces to increase the TENGs' effective contact area and, therefore, output power. We deploy a novel bench-top fabrication method called dynamic Scanning Probe Lithography (d-SPL) to fabricate massive arrays of uniform 1 cm long and 2.5 µm wide nano-features comprising a 600 nm deep groove (NG) and a 600 nm high triangular prism (NTP).

Built-In Packaging for Two-Terminal Devices.

Conventional packaging and interconnection methods for two-terminal devices, e.g., diodes often involve expensive and bulky equipment, introduce parasitic effects and have reliability issues.

Deformable mirror-based photoacoustic remote sensing (PARS) microscopy for depth scanning.

Optically shifting the focal plane to allow depth scanning of delicate biological structures and processes in their natural environment offers an appealing alternative to conventional mechanical scanning. Our technique uses a deformable mirror-based photoacoustic remote sensing microscopy (PARS) with a focus shifting of Δz ∼ 240 µm. We achieve this by integrating a deformable mirror that functions as a varifocal mirror for axial scanning.

Detection Methods for Multi-Modal Inertial Gas Sensors.

We investigate the rich potential of the multi-modal motions of electrostatically actuated asymmetric arch microbeams to design higher sensitivity and signal-to-noise ratio (SNR) inertial gas sensors. The sensors are made of fixed-fixed microbeams with an actuation electrode extending over one-half of the beam span in order to maximize the actuation of asymmetry. A nonlinear dynamic reduced-order model of the sensor is first developed and validated.

Built-In Packaging for Single Terminal Devices.

An alternative packaging method, termed built-in packaging, is proposed for single terminal devices, and demonstrated with an actuator application. Built-in packaging removes the requirements of wire bonding, chip carrier, PCB, probe station, interconnection elements, and even wires to drive single terminal devices. Reducing these needs simplifies operation and eliminates possible noise sources.