Shear Instability and Localization in High-Speed Cold Spray Processes: Impact on Particle Fragmentation and Bonding Mechanisms.

This study investigates the deformation behavior and interfacial phenomena occurring during the high-velocity impact of a copper particle into a copper substrate under various conditions using FEM. It also offers an enhanced physics-based model based on discrete dislocation dynamics simulations to depict newly observed features such as interfacial instabilities and shear localization leading to bonding and particle fragmentation. To investigate bonding mechanisms at the particle-substrate interface, additional simulations using a one-element-thickness model are conducted.