Pseudo-Wet Plasma Mechanism Enabling High-Throughput Dry Etching of SiO by Cryogenic-Assisted Surface Reactions.

Manufacturing semiconductor devices requires advanced patterning technologies, including reactive ion etching (RIE) based on the synergistic interactions between ions and etch gas. However, these interactions weaken as devices continuously scale down to sub-nanoscale, primarily attributed to the diminished transport of radicals and ions into the small features. This leads to a significant decrease in etch rate (ER).

Double-sided computer-generated holography.

We present a method for computer-generated holography (CGH) in which different images are reproduced on both sides of a hologram with a single illumination source. In the proposed method, we use a transmissive spatial light modulator (SLM) and a half mirror (HM) located downstream of the SLM. The light modulated by the SLM is partially reflected by the HM, and the reflected light is modulated again by the SLM for the double-sided image reproduction.

Incoherent computer-generated holography: publisher's note.

This publisher's note contains a correction to Opt. Lett.47, 3844 (2022)10.

Incoherent computer-generated holography.

We present a method for computer-generated holography (CGH) using spatially and temporally incoherent light. The proposed method synthesizes a hologram cascade by solving an inverse problem for the propagation of incoherent light. The spatial incoherence removes speckle noise in CGH, and the temporal incoherence simplifies the optical setup, including the light source.

Formation scheme of quantum point contacts based on nanogaps using field-emission-induced electromigration.

We propose a new fabrication scheme of quantum point contacts (QPCs) composed of nanogaps at room temperature. This scheme is based on electromigration induced by a field emission current, which is so-called "activation." By applying the activation to ferromagnetic Ni nanogaps with sub-10 nm separation, QPCs can be easily obtained at room temperature.