Publications by authors named "Ruicong Lv"

The rapid development of modern electronic devices increasingly requires thermal management materials with controllable electrical properties, ranging from conductive and dielectric to insulating, to meet the needs of diverse applications. However, highly thermally conductive materials usually have a high electrical conductivity. Intrinsically highly thermally conductive, but electrically insulating materials are still limited to a few kinds of materials.

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Article Synopsis
  • There is a growing need for materials that combine high thermal conductivity (TC) and excellent electrical insulation for microelectronic devices due to the trend of miniaturization.
  • This study introduces innovative boron nitride (BN) and graphite films layered with silicone rubber composites that achieve impressive TC of 23.7 Wm K and a low compressive modulus of 4.85 MPa.
  • The tested composites demonstrate outstanding heat dissipation, significantly improving CPU cooling systems, and highlight the potential for broader use in managing thermal efficiency in future electronics.
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With the rapid development of the electronics industry, there is a growing demand for packaging materials that possess both high thermal conductivity (TC) and low electrical conductivity (EC). However, traditional insulating fillers such as boron nitride, aluminum nitride, and alumina (AlO) have relatively low intrinsic TC. When graphene, which exhibits both superhigh TC and EC, is used as a filler to fill epoxy resin, the TC of blends can be much higher than that of blends containing more traditional fillers.

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Article Synopsis
  • Orientation control of anisotropic materials like graphene and boron nitride is crucial for fields such as materials design and energy storage.
  • A new scalable method is introduced that uses expansion flow to align 2D BN platelets vertically in silicone gel strips, achieving a unique curved orientation.
  • This vertical alignment enhances thermal conductivity significantly, with potential applications in batteries, electronics, and energy storage devices.
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Extrusion-based three-dimensional (3D) printing techniques usually exhibit anisotropic thermal, mechanical, and electric properties due to the shearing-induced alignment during extrusion. However, the transformation from the extrusion to stacking process is always neglected and its influence on the final properties remains ambiguous. In this work, we adopt two different sized boron nitride (BN) sheets, namely, small-sized BN (S-BN) and large-sized BN (L-BN), to explore their impact on the orientation degree, morphology, and final anisotropic thermal conductivity (TC) of thermoplastic polyurethane (TPU) composites by fused deposition modeling.

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Efficient thermal transportation in a preferred direction is highly favorable for thermal management issues. The combination of 3D printing and two-dimensional (2D) materials such as graphene, BN, and so on enables infinite possibilities for hierarchically aligned structure programming. In this work, we report the formation of the asymmetrically aligned structure of graphene filled thermoplastic polyurethane (TPU) composites during 3D printing process.

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