A flexible protruding microelectrode array for neural interfacing in bioelectronic medicine.

Recording neural signals from delicate autonomic nerves is a challenging task that requires the development of a low-invasive neural interface with highly selective, micrometer-sized electrodes. This paper reports on the development of a three-dimensional (3D) protruding thin-film microelectrode array (MEA), which is intended to be used for recording low-amplitude neural signals from pelvic nervous structures by penetrating the nerves transversely to reduce the distance to the axons. Cylindrical gold pillars (Ø 20 or 50 µm, ~60 µm height) were fabricated on a micromachined polyimide substrate in an electroplating process.

The effects of annealing on mechanical, chemical, and physical properties and structural stability of Parylene C.

Parylene C is one of the established encapsulation polymers for chronic implants. We investigated the influence of annealing Parylene C on its mechanical properties, chemical structure, and on the stability of Parylene C - platinum - Parylene C sandwich structures as a model of flexible neural interfaces in 0.9 % saline solution.

Characterization of parylene C as an encapsulation material for implanted neural prostheses.

The applicability of parylene C as an encapsulation material for implanted neural prostheses was characterized and optimized. The adhesion of parylene C was tested on different substrate materials, which were commonly used in neural prostheses and the efficiency of different adhesion promotion methods was investigated. On Si(3)N(4), platinum, and on a first film of parylene C, a satisfactory adhesion was achieved with Silane A-174, which even withstood standard steam sterilization.

A wireless system for monitoring polymer encapsulations.

We present a principle for monitoring of the electrical properties of polymers used as insulators for electrically active implants. This method can be used for measurements in vitro and in vivo with incomplex instrumentation. The system is based on the detuning of an oscillating circuit with an interdigital electrode (IDE) structure serving as a capacitive and resistive sensor within the oscillator.