Publications by authors named "Rene Selbmann"

As a result of conventional wire-forming processes, the residual stress distribution in wires is frequently unfavorable for subsequent forming processes such as bending operations. High tensile residual stresses typically occur in the near-surface region of the wires and can limit further application and processability of the semi-finished products. This paper presents an approach for tailoring the residual stress distribution by modifying the forming process, especially with regard to the die geometry and the influence of the drawing velocity as well as the wire temperature.

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After conventional forming processes, the residual stress distribution in wires is frequently unfavorable for subsequent processes, such as bending operations. High tensile residual stresses typically occur near the wire surface and normally limit further processability of the material. Additional heat treatment operations or shot peening are often used to influence the residual stress distribution in the material after conventional manufacturing, which is time- and energy-consuming.

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