Publications by authors named "Ren Zheng Qiu"

A quasi-continuum (QC) method based on the embedded atom method (EAM) potential was employed to investigate the fatigue crack growth and expansion characteristics of single-crystal Fe and Ni under cyclic loading modes I and II. In particular, the crack growth and expansion characteristics of Fe and Ni under cyclic loading were evaluated in terms of atomic stress fields and force-distance curves. The simulation results indicated that under cyclic loading, the initially damaged area of the crack will coalesce again after compression or shear to the initial geometry leading to a strengthening of the material.

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In this paper, γ-butyrolactone (GBL) solvent vapor post-annealing (SVPA) on CHNHPbI thin films is reported, aiming to improve the complete transformation of PbI and increase the grain size of the CHNHPbI crystal, thus boosting the performance of mesoporous CHNHPbI perovskite solar cells (PSCs). The influence of GBL SVPA on the microstructure of perovskite layers and performance of PSCs was studied. The short circuit current density ( ) of the devices significantly increased, yielding a high efficiency of 16.

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The dynamic nanomechanical characteristics of Cu films with different grain boundaries under nanoindentation and scratch conditions were studied by molecular dynamics (MD) simulations. The type of grain boundary is the main factor in the control of the substrate atoms with respect to the size of dislocations since the existence of the grain boundary itself restricts the movement associated with dislocations. In this work, we analyzed the transverse and vertical grain boundaries for different angles.

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