On the Resolution Limit of Electrohydrodynamic Redox 3D Printing.

Additive manufacturing (AM) will empower the next breakthroughs in nanotechnology by combining unmatched geometrical freedom with nanometric resolution. Despite recent advances, no micro-AM technique has been able to synthesize functional nanostructures with excellent metal quality and sub-100 nm resolution. Here, significant breakthroughs in electrohydrodynamic redox 3D printing (EHD-RP) are reported by directly fabricating high-purity Cu (>98 at.

Soft Self-Regulating Heating Elements for Thermoplastic Elastomer-Based Electronic Skin Applications.

Resistive heating elements can be of particular interest for many applications, such as e-skin. In this study, soft heating elements were developed by combining thermoplastic polyurethane (TPU) with carbon black. In contrast to previous studies on thermoplastic polymer-based thermistors, the heating elements could endure elongations above 100%.

Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Size.

Additive microfabrication processes based on localized electroplating enable the one-step deposition of micro-scale metal structures with outstanding performance, e.g., high electrical conductivity and mechanical strength.

Nanodroplet Flight Control in Electrohydrodynamic Redox 3D Printing.

Electrohydrodynamic 3D printing is an additive manufacturing technique with enormous potential in plasmonics, microelectronics, and sensing applications thanks to its broad material palette, high voxel deposition rate, and compatibility with various substrates. However, the electric field used to deposit material is concentrated at the depositing structure, resulting in the focusing of the charged droplets and geometry-dependent landing positions, which complicates the fabrication of complex 3D shapes. The low level of concordance between the design and printout seriously impedes the development of electrohydrodynamic 3D printing and rationalizes the simplicity of the designs reported so far.

Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.

As the microelectronics field pushes to increase device density through downscaling component dimensions, various novel micro- and nano-scale additive manufacturing technologies have emerged to expand the small scale design space. These techniques offer unprecedented freedom in designing 3D circuitry but have not yet delivered device-grade materials. To highlight the complex role of processing on the quality and microstructure of AM metals, we report the electrical properties of micrometer-scale copper interconnects fabricated by Fluid Force Microscopy (FluidFM) and Electrohydrodynamic-Redox Printing (EHD-RP).

Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core-shell structures.

Electrohydrodynamic redox 3D printing (EHD-RP) is an additive manufacturing (AM) technique with submicron resolution and multi-metal capabilities, offering the possibility to switch chemistry during deposition "on-the-fly". Despite the potential for synthesizing a large range of metals by electrochemical small-scale AM techniques, to date, only Cu and Ag have been reproducibly deposited by EHD-RP. Here, we extend the materials palette available to EHD-RP by using aqueous solvents instead of organic solvents, as used previously.

Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing.

The control of materials' microstructure is both a necessity and an opportunity for micro/nanometer-scale additive manufacturing technologies. On the one hand, optimization of purity and defect density of printed metals is a prerequisite for their application in microfabrication. On the other hand, the additive approach to materials deposition with highest spatial resolution offers unique opportunities for the fabrication of materials with complex, 3D graded composition or microstructure.

Nanoscale electrochemical 3D deposition of cobalt with nanosecond voltage pulses in an STM.

To explore a minimal feature size of <100 nm with electrochemical additive manufacturing, we use a strategy originally applied to microscale electrochemical machining for the nanoscale deposition of Co on Au. The concept's essence is the localization of electrochemical reactions below a probe during polarization with ns-long voltage pulses. As shown, a confinement that exceeds that predicted by a simple model based on the time constant for one-dimensional double layer charging enables a feature size of <100 nm for 2D patterning.

Confined pulsed diffuse layer charging for nanoscale electrodeposition with an STM.

Regulating the state of the solid-liquid interface by means of electric fields is a powerful tool to control electrochemistry. In scanning probe systems, this can be confined closely to a scanning (nano)electrode by means of fast potential pulses, providing a way to probe the interface and control electrochemical reactions locally, as has been demonstrated in nanoscale electrochemical etching. For this purpose, it is important to know the spatial extent of the interaction between pulses applied to the tip, and the substrate.

Chemical Engineering of Cu-Sn Disordered Network Metamaterials.

The design and fabrication of large-area metamaterials is an ongoing challenge. In the present work, we propose a scalable design route and low-footprint strategy for the production of large-area, frequency-selective Cu-Sn disordered network metamaterials with quasi-perfect absorption. The nanoscale networks combine the robustness of disordered systems with the broad-band optical response known from connected wire-mesh metamaterials.

3D electrohydrodynamic printing and characterisation of highly conductive gold nanowalls.

3D printing research targets the creation of nanostructures beyond the limits of traditional micromachining. A proper characterisation of their functionalities is necessary to facilitate future implementation into applications. We fabricate, in an open atmosphere, high-aspect-ratio gold nanowalls by electrohydrodynamic rapid nanodripping, and comprehensively analyse their electronic performance by four-point probe measurements.

Metals by Micro-Scale Additive Manufacturing: Comparison of Microstructure and Mechanical Properties.

Many emerging applications in microscale engineering rely on the fabrication of 3D architectures in inorganic materials. Small-scale additive manufacturing (AM) aspires to provide flexible and facile access to these geometries. Yet, the synthesis of device-grade inorganic materials is still a key challenge toward the implementation of AM in microfabrication.

Achieving micron-scale plasticity and theoretical strength in Silicon.

As the backbone material of the information age, silicon is extensively used as a functional semiconductor and structural material in microelectronics and microsystems. At ambient temperature, the brittleness of Si limits its mechanical application in devices. Here, we demonstrate that Si processed by modern lithography procedures exhibits an ultrahigh elastic strain limit, near ideal strength (shear strength ~4 GPa) and plastic deformation at the micron-scale, one order of magnitude larger than samples made using focused ion beams, due to superior surface quality.

Thermal Management in Ni/Al Reactive Multilayers: Understanding and Preventing Reaction Quenching on Thin Film Heat Sinks.

Thermal management is conventionally the design of microelectronics circuitry to maximize heat extraction and minimize local heating. In this work, we investigate a reverse thermal management problem related to understanding and preventing heat dissipation during the propagation of a self-sustained reaction in Ni/Al reactive multilayers, metastable nanostructures that can release heat through a self-sustained propagating exothermic reaction. While it was recently demonstrated that reactive multilayers can serve as on-chip heat sources for on-demand healing of metal films, they still face challenges of device integration due to conductive heat losses to the substrate or adjacent on-chip components, which act as heat sinks and consequently quench the reaction.

Multi-metal electrohydrodynamic redox 3D printing at the submicron scale.

An extensive range of metals can be dissolved and re-deposited in liquid solvents using electrochemistry. We harness this concept for additive manufacturing, demonstrating the focused electrohydrodynamic ejection of metal ions dissolved from sacrificial anodes and their subsequent reduction to elemental metals on the substrate. This technique, termed electrohydrodynamic redox printing (EHD-RP), enables the direct, ink-free fabrication of polycrystalline multi-metal 3D structures without the need for post-print processing.

Ice-Templated W-Cu Composites with High Anisotropy.

Controlling anisotropy in self-assembled structures enables engineering of materials with highly directional response. Here, we harness the anisotropic growth of ice walls in a thermal gradient to assemble an anisotropic refractory metal structure, which is then infiltrated with Cu to make a composite. Using experiments and simulations, we demonstrate on the specific example of tungsten-copper composites the effect of anisotropy on the electrical and mechanical properties.

Scalable, ultra-resistant structural colors based on network metamaterials.

Structural colors have drawn wide attention for their potential as a future printing technology for various applications, ranging from biomimetic tissues to adaptive camouflage materials. However, an efficient approach to realize robust colors with a scalable fabrication technique is still lacking, hampering the realization of practical applications with this platform. Here, we develop a new approach based on large-scale network metamaterials that combine dealloyed subwavelength structures at the nanoscale with lossless, ultra-thin dielectric coatings.

Nanocrystalline High-Entropy Alloys: A New Paradigm in High-Temperature Strength and Stability.

Metals with nanometer-scale grains or nanocrystalline metals exhibit high strengths at ambient conditions, yet their strengths substantially decrease with increasing temperature, rendering them unsuitable for usage at high temperatures. Here, we show that a nanocrystalline high-entropy alloy (HEA) retains an extraordinarily high yield strength over 5 GPa up to 600 °C, 1 order of magnitude higher than that of its coarse-grained form and 5 times higher than that of its single-crystalline equivalent. As a result, such nanostructured HEAs reveal strengthening figures of merit-normalized strength by the shear modulus above 1/50 and strength-to-density ratios above 0.

Additive Manufacturing of Metal Structures at the Micrometer Scale.

Currently, the focus of additive manufacturing (AM) is shifting from simple prototyping to actual production. One driving factor of this process is the ability of AM to build geometries that are not accessible by subtractive fabrication techniques. While these techniques often call for a geometry that is easiest to manufacture, AM enables the geometry required for best performance to be built by freeing the design process from restrictions imposed by traditional machining.

Superior room-temperature ductility of typically brittle quasicrystals at small sizes.

The discovery of quasicrystals three decades ago unveiled a class of matter that exhibits long-range order but lacks translational periodicity. Owing to their unique structures, quasicrystals possess many unusual properties. However, a well-known bottleneck that impedes their widespread application is their intrinsic brittleness: plastic deformation has been found to only be possible at high temperatures or under hydrostatic pressures, and their deformation mechanism at low temperatures is still unclear.

Polymer nanocomposite patterning by dip-pen nanolithography.

The ultimate aim of this study is to construct polymer nanocomposite patterns by dip-pen nanolithography (DPN). Recent investigations have revealed the effect of the amount of ink (Laplace pressure) on the mechanism of liquid ink writing. In this study it is shown that not only the amount of ink, but also physisorption and surface diffusion are relevant.

Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition.

A novel 3D printing method for voxel-by-voxel metal printing is presented. Hollow atomic force microscopy (AFM) cantilevers are used to locally supply metal ions in an electrochemical cell, enabling a localized electroplating reaction. By exploiting the deflection feedback of these probes, electrochemical 3D metal printing is, for the first time, demonstrated in a layer-by-layer fashion, enabling the fabrication of arbitrary-shaped geometries.

The Hidden Pathways in Dense Energy Materials - Oxygen at Defects in Nanocrystalline Metals.

Highly abundant oxygen-rich line defects (blue) can act as fast oxygen transport paths. These defects show similar chemistry and therefore similar catalytic activity to the materials surface. These results provide the opportunity to design and produce simple scalable structures as catalysts, whose functionality derives from internal defects rather than from the materials surfaces.