Publications by authors named "Raik Hoffmann"

Organic electrochemical transistors (OECTs) underpin a range of emerging technologies, from bioelectronics to neuromorphic computing, owing to their unique coupling of electronic and ionic charge carriers. In this context, various OECT systems exhibit significant hysteresis in their transfer curve, which is frequently leveraged to achieve non-volatility. Meanwhile, a general understanding of its physical origin is missing.

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Characterization of thermoelectric transport properties for temperature sensing, cooling, and energy harvesting applications is necessary for a reliable device performance in progressively minimized computer chips. In this contribution, we present a fully automated thermovoltage and sheet resistance measurement setup, which is calibrated and tested for the production of silicon- and silicon-germanium-doped as well as silicide complementary metal-oxide-semiconductor-compatible thin films. A LabVIEW-programmed software application automatically controls the measurement and recording of thermovoltages at individually defined temperature set points.

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This article reports an improvement in the performance of the hafnium oxide-based (HfO) ferroelectric field-effect transistors (FeFET) achieved by a synergistic approach of interfacial layer () engineering and -voltage optimization. FeFET devices with silicon dioxide (SiO) and silicon oxynitride (SiON) as were fabricated and characterized. Although the FeFETs with SiO interfaces demonstrated better low-frequency characteristics compared to the FeFETs with SiON interfaces, the latter demonstrated better endurance and retention.

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The discovery of ferroelectricity in the fluorite structure based hafnium oxide (HfO) material sparked major efforts for reviving the ferroelectric field effect transistor (FeFET) memory concept. A Novel metal-ferroelectric-metal-ferroelectric-insulator-semiconductor (MFMFIS) FeFET memory is reported based on dual ferroelectric integration as an MFM and MFIS in a single gate stack using Si-doped Hafnium oxide (HSO) ferroelectric (FE) material. The MFMFIS top and bottom electrode contacts, dual HSO based ferroelectric layers, and tailored MFM to MFIS area ratio (AR-TB) provide a flexible stack structure tuning for improving the FeFET performance.

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