Phys Chem Chem Phys
December 2021
The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC).
View Article and Find Full Text PDFAt present, the most commonly used electrical insulating materials, including cold-curing epoxy resins, are well designed for normal operating conditions. However, new generations of materials should also be capable of withstanding extreme emergency conditions, e.g.
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