In a popular integration process for quantum information technologies, localization microscopy of quantum emitters guides lithographic placement of photonic structures. However, a complex coupling of microscopy and lithography errors degrades registration accuracy, severely limiting device performance and process yield. We introduce a methodology to solve this widespread but poorly understood problem.
View Article and Find Full Text PDFGravimetry typically lacks the resolution to measure single microdroplets, whereas microscopy is often inaccurate beyond the resolution limit. To address these issues, we advance and integrate these complementary methods, introducing simultaneous measurements of the same microdroplets, comprehensive calibrations that are independently traceable to the International System of Units (SI), and Monte-Carlo evaluations of volumetric uncertainty. We achieve sub-picoliter agreement of measurements of microdroplets in flight with volumes of approximately 70 pL, with ensemble gravimetry and optical microscopy both yielding 95% coverage intervals of ±0.
View Article and Find Full Text PDFJ Micro Nanolithogr MEMS MOEMS
January 2020
Nanoscale wear affects the performance of atomic force microscopy (AFM)-based measurements for all applications including process control measurements and nanoelectronics characterization. As such, methods to prevent or reduce AFM tip wear is an area of active research. However, most prior work has been on conventional AFMs rather than critical dimension AFM (CD-AFM).
View Article and Find Full Text PDFSince 2004 standards for calibration of critical dimension atomic force microscope (CD-AFM) tip width have been available both commercially and through national metrology institutes (NMIs) - such as the National Institute of Standards and Technology (NIST) in the United States. There have been inter-laboratory and inter-method comparisons performed on such samples, but less attention has been paid to the long-term stability of standards and monitoring for damage, wear, or contamination. Using three different CD-AFM instruments, we have tested the consistency and long-term stability of two independent reference calibrations for CD-AFM tip width.
View Article and Find Full Text PDFInternational comparisons between National Metrology Institutes (NMIs) are important to verify measurement results and the associated uncertainties. In this paper, we report a comparison of the line width calibration of a crystalline silicon line width standard, referred to as IVPS100-PTB standard, between the Physikalisch-Technische Bundesanstalt (PTB) in Germany and the National Institute of Standards and Technology (NIST) in the United States. Critical Dimension Atomic Force Microscopy (CD-AFM) was the measurement method used for this comparison.
View Article and Find Full Text PDFJ Micro Nanolithogr MEMS MOEMS
July 2016
The decreasing size of semiconductor features and the increasing structural complexity of advanced devices have placed continuously greater demands on manufacturing metrology, arising both from the measurement challenges of smaller feature sizes and the growing requirement to characterize structures in more than just a single critical dimension. For scanning electron microscopy, this has resulted in increasing sophistication of imaging models. For critical dimension atomic force microscopes (CD-AFMs), this has resulted in the need for smaller and more complex tips.
View Article and Find Full Text PDFJ Micro Nanolithogr MEMS MOEMS
January 2016
Sidewall sensing in critical dimension atomic force microscopes (CD-AFMs) usually involves continuous lateral dithering of the tip or the use of a control algorithm and fast response piezo actuator to position the tip in a manner that resembles touch-triggering of coordinate measuring machine (CMM) probes. All methods of tip position control, however, induce an effective tip width that may deviate from the actual geometrical tip width. Understanding the influence and dependence of the effective tip width on the dither settings and lateral stiffness of the tip can improve the measurement accuracy and uncertainty estimation for CD-AFM measurements.
View Article and Find Full Text PDFQuantitative optical measurements of deep sub-wavelength, three-dimensional, nanometric structures with sensitivity to sub-nanometer details address an ubiquitous measurement challenge. A Fourier domain normalization approach is used in the Fourier optical imaging code to simulate the full three-dimensional scattered light field of nominally 15 nm sized structures, accurately replicating the light field as a function of the focus position. Using the full three-dimensional light field, nanometer scale details such as a 2 nm thin conformal oxide and nanometer topography are rigorously fitted for features less than 1/30 of the wavelength in size.
View Article and Find Full Text PDFIn atomic force microscopy (AFM) metrology, the tip is a key source of uncertainty. Images taken with an AFM show a change in feature width and shape that depends on tip geometry. This geometric dilation is more pronounced when measuring features with high aspect ratios, and makes it difficult to obtain absolute dimensions.
View Article and Find Full Text PDFIt is difficult to predict the measurement bias arising from the compliance of the atomic force microscope (AFM) probe. The issue becomes particularly important in this situation where nanometer uncertainties are sought for measurements with dimensional probes composed of flexible carbon nanotubes mounted on AFM cantilevers. We have developed a finite element model for simulating the mechanical behavior of AFM cantilevers with carbon nanotubes attached.
View Article and Find Full Text PDFStaffs of the Semiconductor Electronics Division, the Information Technology Laboratory, and the Precision Engineering Laboratory at NIST, have developed a new generation of prototype Single-Crystal CD (Critical Dimension) Reference (SCCDRM) Materials with the designation RM 8111. Their intended use is calibrating metrology instruments that are used in semiconductor manufacturing. Each reference material is configured as a 10 mm × 11 mm silicon test-structure chip that is mounted in a 200 mm silicon carrier wafer.
View Article and Find Full Text PDF