Novel axial dynamic mechanical analysis setup for thermo-analytical study and curing kinetics optimization of thermoset adhesives.

Thermo-analytical studies of thermoset adhesives, either during research and development or in quality assurance activities, involve the application of various analytical equipment for adhesive characterization, from initial mixing to final product decomposition. Gelation is usually measured with rheometers or dynamic mechanical analyzers (DMAs); curing, post-curing, and curing kinetics are often studied using differential scanning calorimetry (DSC). Glass transition temperature (T) is measured via DSC or DMA, and finally, thermal decomposition measurements are done using thermal gravimetric analysis.

Influence of POSS Type on the Space Environment Durability of Epoxy-POSS Nanocomposites.

In order to use polymers at low Earth orbit (LEO) environment, they must be protected against atomic oxygen (AO) erosion. A promising protection strategy is to incorporate polyhedral oligomeric silsesquioxane (POSS) molecules into the polymer backbone. In this study, the space durability of epoxy-POSS (EPOSS) nanocomposites was investigated.

The Effect of POSS Type on the Shape Memory Properties of Epoxy-Based Nanocomposites.

Thermally activated shape memory polymers (SMPs) can memorize a temporary shape at low temperature and return to their permanent shape at higher temperature. These materials can be used for light and compact space deployment mechanisms. The control of transition temperature and thermomechanical properties of epoxy-based SMPs can be done using functionalized polyhedral oligomeric silsesquioxane (POSS) additives, which are also known to improve the durability to atomic oxygen in the space environment.

Advances in Polyimide-Based Materials for Space Applications.

The space environment raises many challenges for new materials development and ground characterization. These environmental hazards in space include solar radiation, energetic particles, vacuum, micrometeoroids and debris, and space plasma. In low Earth orbits, there is also a significant concentration of highly reactive atomic oxygen (AO).

3D Graphene-Infused Polyimide with Enhanced Electrothermal Performance for Long-Term Flexible Space Applications.

Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render high temperature and UV stability and toughness. However, their poor thermal conductivity and completely electrically insulating characteristics have caused other limitations, such as thermal management challenges for flexible high-power electronics and spacecraft electrostatic charging.