12-Spin-Qubit Arrays Fabricated on a 300 mm Semiconductor Manufacturing Line.

Intel's efforts to build a practical quantum computer are focused on developing a scalable spin-qubit platform leveraging industrial high-volume semiconductor manufacturing expertise and 300 mm fabrication infrastructure. Here, we provide an overview of the design, fabrication, and demonstration of a new customized quantum test chip, which contains 12-quantum-dot spin-qubit linear arrays, code named Tunnel Falls. These devices are fabricated using immersion and extreme ultraviolet lithography (EUV), along with other standard high-volume manufacturing (HVM) processes as well as production-level process control.

Probing single electrons across 300-mm spin qubit wafers.

Building a fault-tolerant quantum computer will require vast numbers of physical qubits. For qubit technologies based on solid-state electronic devices, integrating millions of qubits in a single processor will require device fabrication to reach a scale comparable to that of the modern complementary metal-oxide-semiconductor (CMOS) industry. Equally important, the scale of cryogenic device testing must keep pace to enable efficient device screening and to improve statistical metrics such as qubit yield and voltage variation.

Valley Splitting in Silicon from the Interference Pattern of Quantum Oscillations.

We determine the energy splitting of the conduction-band valleys in two-dimensional electrons confined in silicon metal oxide semiconductor Hall-bar transistors. These silicon metal oxide semiconductor Hall bars are made by advanced semiconductor manufacturing on 300 mm silicon wafers and support a two-dimensional electron gas of high quality with a maximum mobility of 17.6×10^{3}  cm^{2}/Vs and minimum percolation density of 3.

Academic and industry research progress in germanium nanodevices.

Silicon has enabled the rise of the semiconductor electronics industry, but it was not the first material used in such devices. During the 1950s, just after the birth of the transistor, solid-state devices were almost exclusively manufactured from germanium. Today, one of the key ways to improve transistor performance is to increase charge-carrier mobility within the device channel.

Spin polarization dependence of the coulomb drag at large r(s).

We find that the temperature dependence of the drag resistivity between two dilute two-dimensional hole systems exhibits an unusual dependence upon spin polarization. Our main observation is that near the apparent metal-insulator transition, the temperature dependence of the drag, given by Talpha, weakens significantly with the application of a parallel magnetic field (B(||)), with alpha saturating at half its zero field value for B(||)>B(*), where B(*) is the polarization field.