Publications by authors named "R M Soukup"

Tendinopathy, a prevalent overuse injury, lacks effective treatment options, leading to a significant impact on quality of life and socioeconomic burden. Mesenchymal stem/stromal cells (MSCs) and their secretome, including conditioned medium (CM) and extracellular vesicles (EVs), have shown promise in tissue regeneration and immunomodulation. However, it remains unclear which components of the secretome contribute to their therapeutic effects.

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Nowadays, a range of sensors and actuators can be realized directly in the structure of textile substrates using metal-plated yarns, metal-filament yarns, or functionalized yarns with nanomaterials, such as nanowires, nanoparticles, or carbon materials. However, the evaluation or control circuits still depend upon the use of semiconductor components or integrated circuits, which cannot be currently implemented directly into the textiles or substituted by functionalized yarns. This study is focused on a novel thermo-compression interconnection technique intended for the realization of the electrical interconnection of SMD components or modules with textile substrates and their encapsulation in one single production step using commonly widespread cost-effective devices, such as 3D printers and heat-press machines, intended for textile applications.

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Extracellular vesicles (EVs) are nanosized lipid bilayer-encapsulated particles secreted by virtually all cell types. EVs play an essential role in cellular crosstalk in health and disease. The cellular origin of EVs determines their composition and potential therapeutic effect.

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Adjuvants are commonly employed to enhance the efficacy of a vaccine and thereby increase the resulting immune response in a patient. The activity and effectiveness of emulsion-based adjuvants has been heavily studied throughout pharmaceuticals; however, there exists a lack in research which monitors the formation of a stable emulsion in real time. Process analytical technology (PAT) provides a solution to meet this need.

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The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC).

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