Dual phase (DP) steels provide good strength and ductility properties. Nevertheless, their forming capability is limited due to the damage characteristics of their constituting microstructural phases and interfaces. In this work, a specific type of interface is analysed, i.
View Article and Find Full Text PDFThe combination of digital image correlation (DIC) and scanning electron microscopy (SEM) enables to extract high resolution full field displacement data, based on the high spatial resolution of SEM and the sub-pixel accuracy of DIC. However, SEM images may exhibit a considerable amount of imaging artifacts, which may seriously compromise the accuracy of the displacements and strains measured from these images. The current study proposes a unified general framework to correct for the three dominant types of SEM artifacts, i.
View Article and Find Full Text PDFHigh resolution scanning electron microscopy (HR-SEM) is nowadays very popular for different applications in different fields. However, SEM images may exhibit a considerable amount of imaging artifacts, which induce significant errors if the images are used to measure geometrical or kinematical fields. This error is most pronounced in case of full field deformation measurements, for instance by digital image correlation (DIC).
View Article and Find Full Text PDFThis randomized controlled trial aimed to evaluate the duration and outcome quality of orthodontic treatment with a customized fixed appliance system versus a noncustomized system. Patients ( n = 180) were randomized and received orthodontic treatment with the Insignia customized orthodontic system or the Damon Q noncustomized orthodontic system. The allocation sequence was concealed using identical, sequentially numbered, opaque, sealed envelopes.
View Article and Find Full Text PDFPhilos Trans A Math Phys Eng Sci
April 2012
Laminated paperboard is used as a packaging material for a wide range of products. During production of the packaging, the fold lines are first defined in a so-called creasing (or scoring) operation in order to obtain uncracked folds. During creasing as well as folding, cracking of the board is to be avoided.
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