The Ni mesh was incorporated into the Cu/Sn58Bi/Cu bonding as a reinforcing skeleton to achieve an enhancement effect analogous to steel reinforcement in concrete. Ultrasonic-assisted soldering (UAS) improved the metallurgical bond among the solder, Ni mesh, and substrate. It facilitated the formation of (Cu, Ni)Sn intermetallic compounds (IMCs) layers, increasing the joint strength.
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