Application of a Single Cell Electric-SRR Metamaterial for Strain Evaluation.

Strain is a crucial assessment parameter in structural health monitoring systems. Microstrip sensors have been one of the new types of sensors used to measure this parameter in recent years. So far, the strain directionality of these sensors and the methods of miniaturization have been studied.

Detection and Identification of Defects in 3D-Printed Dielectric Structures via Thermographic Inspection and Deep Neural Networks.

In this paper, we propose a new method based on active infrared thermography (IRT) applied to assess the state of 3D-printed structures. The technique utilized here-active IRT-assumes the use of an external energy source to heat the tested material and to create a temperature difference between undamaged and defective areas, and this temperature difference is possible to observe with a thermal imaging camera. In the case of materials with a low value of thermal conductivity, such as the acrylonitrile butadiene styrene (ABS) plastic printout tested in the presented work, the obtained temperature differences are hardly measurable.

A System for Monitoring of Broadband FMR Phenomenon in Low-Carbon Steel Films Subjected to Deformations.

Stresses and deformations are some of the main factors influencing the mechanical and magnetic properties of steels. Resonance methods, based on the utilization of high-frequency electromagnetic fields, are the ones that can provide information about the course of the magnetization process. Moreover, according to skin effect, these methods may show sensitivity to surface deformations of the examined materials as well.

Glass-Adhesive-Steel Joint Inspection Using Mechanic and High Frequency Electromagnetic Waves.

The utilization of a glass-adhesive-steel joint in modern machine and vehicle production is constantly growing. Despite the technological regime during the production process, various defects in the adhesive joints may occur. One of the major problems is lack of adhesive between joined materials.

Microstrip Patch Strain Sensor Miniaturization Using Sierpinski Curve Fractal Geometry.

In this paper miniaturization of a microstrip patch strain sensor (MPSS) using fractal geometry was proposed and analyzed. For this purpose, the transducer of Sierpinski curve geometry was utilized and compared with the most commonly utilized rectangular resonator-based one. Both sensors were designed for the same resonant frequency value (2.

A Circular Microstrip Antenna Sensor for Direction Sensitive Strain Evaluation.

In this paper, a circular microstrip antenna for stress evaluation is studied. This kind of microstrip sensor can be utilized in structural health monitoring systems. Reflection coefficient is measured to determine deformation/strain value.