Publications by authors named "Prashant P Shinde"

The stiff compromise between reliability and conductivity of copper interconnects used in sub-nanometer nodes has brought into focus the choice of encapsulation material. While reliability was the primary driver so far, herein, we investigate how electronic conductivity of Cu(111) thin films is influenced by the encapsulation material using density functional theory and Boltzmann transport equation. Atomically thin 2D materials, namely conducting graphene and insulating graphane both retain the conductivity of Cu films whereas partially hydrogenated graphene (HGr) results in reduction of surface density of states and a reduction in Cu film conductivity.

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