Correction: Nimbalkar et al. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. 2023, , 3895.

In the original publication [...

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates.

The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues.