Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders.

In this paper, In was introduced into SnPb eutectic solder to develop a new low-temperature solder for three-dimensional packaging technology. SnPbIn solders containing 5, 10, 13, 15 and 17 wt.% In were prepared through vacuum induction melting.

Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth.

PbSn solders are used in semiconductor devices for aerospace or military purposes with high levels of reliability requirements. Microalloying has been widely adopted to improve the reliability for Pb-free solders, but its application in PbSn solders is scarce. In this article, the optimization of PbSn solder reliability with Ge microalloying was investigated using both experimental and calculation methods.