Publications by authors named "Pedro A Lopes"

The last decade observed rapid progress in soft electronics. Yet, the ultimate desired goal for many research fields is to fabricate fully integrated soft-matter electronics with sensors, interconnects, and batteries, at the ease of pushing a print button. In this work, an important step is taken toward this by demonstrating an ultra-stretchable thin-film Silver-Gallium (Ag-Ga) battery with an unprecedented combination of areal capacity and mechanical strain tolerance.

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Soft, conductive, and stretchable hydrogels offer a broad variety of applications, including skin-interfacing electrodes, biomonitoring patches, and electrostimulation. Despite rapid developments over the last decades, a combination of good electrical and mechanical properties, low-cost fabrication, and biocompatibility is yet to be demonstrated. Also, the current methods for deposition and patterning of these hydrogels are manual, and there is a need toward autonomous and digital fabrication techniques.

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Integration of solid-state microchips into soft-matter, and stretchable printed electronics has been the biggest challenge against their scalable fabrication. We introduce, Pol-Gel, a simple technique for self-soldering, self-encapsulation, and self-healing, that allows low cost, scalable, and rapid fabrication of hybrid microchip-integrated ultra-stretchable circuits. After digitally printing the circuit, and placing the microchips, we trigger a Polymer-Gel transition in physically cross-linked block copolymers substrate, and silver liquid metal composite ink, by exposing the circuits to the solvent vapor.

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A bi-phasic ternary Ag-In-Ga ink that demonstrates high electrical conductivity, extreme stretchability, and low electromechanical gauge factor (GF) is introduced. Unlike popular liquid metal alloys such as eutectic gallium-indium (EGaIn), this ink is easily printable and nonsmearing and bonds strongly to a variety of substrates. Using this ink and a simple extrusion printer, the ability to perform direct writing of ultrathin, multi-layer circuits that are highly stretchable (max.

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Bioelectronics stickers that interface the human epidermis and collect electrophysiological data will constitute important tools in the future of healthcare. Rapid progress is enabled by novel fabrication methods for adhesive electronics patches that are soft, stretchable and conform to the human skin. Yet, the ultimate functionality of such systems still depends on rigid components such as silicon chips and the largest rigid component on these systems is usually the battery.

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Stretchable electronics stickers that adhere to the human skin and collect biopotentials are becoming increasingly popular for biomonitoring applications. Such stickers include electrodes, stretchable interconnects, silicon chips for processing and communication, and batteries. Here, we demonstrate a material architecture and fabrication technique for a multilayer, stretchable, low-cost, rapidly deployable, and disposable sticker that integrates skin-interfacing hydrogel electrodes, stretchable interconnects, and a AgO-Zn (silver oxide-zinc) battery.

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Surface biopotentials collected from the human epidermis contain important information about human physiology, such as muscular, heart, and brain activities. However, commercially available wearable biomonitoring devices are generally composed of rigid hardware incompatible with the mechanical compliance of soft human tissues. Thin-film stretchable e-skin circuits that can interface the human skin represent an excellent alternative for long-term wearable biomonitoring.

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We introduce a soft ultrathin and stretchable electronic skin with surface-mounted components that can be transferred and wrapped around any three-dimensional (3D) surface or self-adhere to the human skin. The ∼5 μm thick circuit is fabricated by printing the pattern over a temporary tattoo paper using a desktop laser printer, which is then coated with a silver ink and eutectic gallium-indium (EGaIn) liquid metal alloy. The resulting "Ag-In-Ga" traces are highly conductive and maintain low electrical resistivity as the circuit is stretched to conform to nondevelopable 3D surfaces.

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