Publications by authors named "Pai-Keng Shen"

Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the addition of Fe was discussed in intermetallic compound formation.

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In this study, tensile and creep deformation of a high-entropy alloy processed by selective laser melting (SLM) has been investigated; hot ductility drop was identified at first, and the loss of ductility at elevated temperature was associated with intergranular fracture. By modifying the grain boundary morphology from straight to serration, the hot ductility drop issue has been resolved successfully. The serrated grain boundary could be achieved by reducing the cooling rate of solution heat treatment, which allowed the coarsening of L1 structured γ' precipitates to interfere with mobile grain boundaries, resulting in undulation of the grain boundary morphology.

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