Design and fabrication of vertically-integrated CMOS image sensors.

Technologies to fabricate integrated circuits (IC) with 3D structures are an emerging trend in IC design. They are based on vertical stacking of active components to form heterogeneous microsystems. Electronic image sensors will benefit from these technologies because they allow increased pixel-level data processing and device optimization.

Lateral and longitudinal coupled waveguides in semiconductor lasers.

A semiconductor laser including two laterally coupled waveguides, in which one of the waveguides includes a partially reflecting surface (an internal mirror) between its facets, is analyzed. The internal mirror inserts longitudinal coupling into the system. The spectrum of the Fabry-Perot modes exhibits modulation in the gain required for lasing threshold, with a periodicity that depends on the longitudinal position of the internal mirror.