Silicon integrated circuits (ICs) are central to the next-generation miniature active neural implants, whether packaged in soft polymers for flexible bioelectronics or implanted as bare die for neural probes. These emerging applications bring the IC closer to the corrosive body environment, raising reliability concerns, particularly for chronic use. Here, we evaluate the inherent hermeticity of bare die ICs, and examine the potential of polydimethylsiloxane (PDMS), a moisture-permeable elastomer, as a standalone encapsulation material.
View Article and Find Full Text PDFIEEE Trans Biomed Circuits Syst
August 2020
For mm-sized implants incorporating silicon integrated circuits, ensuring lifetime operation of the chip within the corrosive environment of the body still remains a critical challenge. For the chip's packaging, various polymeric and thin ceramic coatings have been reported, demonstrating high biocompatibility and barrier properties. Yet, for the evaluation of the packaging and lifetime prediction, the conventional helium leak test method can no longer be applied due to the mm-size of such implants.
View Article and Find Full Text PDFIEEE Trans Biomed Circuits Syst
February 2012
This paper presents a flow that is suitable to estimate energy dissipation of digital standard-cell based designs which are determined to operate in the subthreshold regime. The flow is applicable on gate-level netlists, where back-annotated toggle information is used to find the minimum energy operation point, corresponding maximum clock frequency, as well as the dissipated energy per clock cycle. The application of the model is demonstrated by exploring the energy efficiency of pipelining, retiming, and register balancing.
View Article and Find Full Text PDF