Temperature resistant anti-reflective coating on Si-wafer for long-wave infra-red imaging.

A micromachined Silicon lid, sealed by CuSn solid liquid interdiffusion bonding is a promising approach for hermetic sealing of microbolometers for use in low-cost thermal cameras. However, since ∼30% of long-wave infrared light is reflected at an uncoated single Si-air interface, anti-reflective treatments are required. Traditional anti-reflective coatings are inapplicable since CuSn solid liquid interdiffusion bonding requires heating to about 270 °C and these multi-layer coatings fail due to differing coefficients of thermal expansion for the different layers and the substrate.