Improving Glass Transition Temperature and Toughness of Epoxy Adhesives by a Complex Room-Temperature Curing System by Changing the Stoichiometry.

The glass transition temperature (Tg) of room-temperature curing epoxy adhesives is limited by the temperature used during curing. It is already known that the excess of epoxy groups can undergo a homopolymerization reaction initiated by tertiary amines at elevated temperatures, resulting in an increase in Tg. However, there is no evidence of this reaction occurring at room temperature.