Depth sensing is essential for 3D environmental perception across application domains, including autonomous driving, topographical mapping, and augmented and virtual reality (AR/VR). Traditional correlation time-of-flight (ToF) methods, while are able to produce dense high-resolution depth maps, are plagued by phase wrapping artifacts which limit their effective depth range. Though multi-frequency methods can help reduce this problem by simultaneously solving for phase wrap counts in multiple wavelengths, this requires multiple measurements per pixel, necessitating additional hardware and imaging time.
View Article and Find Full Text PDFSolution-processed transparent conductive oxides offer the advantages of low-cost, high-throughput fabrication of electronic devices compared to the specific requirements of vacuum deposition techniques. However, adapting the current state of the art to ink deposition calls for optimization of the precursor ink composition and the postdeposition process. Solution processing of indium tin oxide films can be accomplished at reduced temperatures (250-400 °C) by annealing soluble precursor metal salts together with a fuel/oxidizer, causing an exothermic reaction with elevated local temperatures.
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