Wearable flexible sensors with high sensitivity and wide detection range are applied in motion detection, medical diagnostic result and other fields, but poor resilience and hysteresis remain a challenge. In this study, a high-resilience foam sensor was prepared through a combination of additive manufacturing and green physical foaming method. The conductive filaments were prepared by using MWCNTs-modified TPU by the physical method of melt blending.
View Article and Find Full Text PDFWith the miniaturization and integration of electronic products, the heat dissipation efficiency of electronic equipment needs to be further improved. Notably, polymer materials are a choice for electronic equipment matrices because of their advantages of low cost and wide application availability. However, the thermal conductivity of polymers is insufficient to meet heat dissipation requirements, and their improvements remain challenging.
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