Future optoelectronic devices and their low-cost roll-to-roll production require mechanically flexible transparent electrodes (TEs) and substrate materials. Indium tin oxide (ITO) is the most widely used TE because of its high optical transmission and low electrical sheet resistance. However, ITO, besides being expensive, has very poor performance under mechanical stress because of its fragile oxide nature.
View Article and Find Full Text PDFACS Appl Mater Interfaces
April 2013
An effective method to deposit atomically smooth ultrathin silver (Ag) films by employing a 1 nm copper (Cu) seed layer is reported. The inclusion of the Cu seed layer leads to the deposition of films with extremely low surface roughness (<0.5 nm), while it also reduces the minimum thickness required to obtain a continuous Ag film (percolation thickness) to 3 nm compared to 6 nm without the seed layer.
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