Sidewall patterning of organic-inorganic multilayer thin film encapsulation by adhesion lithography.

A simple sidewall patterning process for organic-inorganic multilayer thin-film encapsulation (TFE) has been proposed and demonstrated. An AlO thin film grown by atomic layer deposition (ALD) was patterned by adhesion lithography using the difference in interfacial adhesion strength. The difference in interfacial adhesion strength was provided by the vapor-deposited fluoro-octyl-trichloro-silane self-assembled monolayer (SAM) patterns formed by a shadow mask.