Well-Adhered Copper Nanocubes on Electrospun Polymeric Fibers.

Electrospun polymer fibers can be used as templates for the stabilization of metallic nanostructures, but metallic species and polymer macromolecules generally exhibit weak interfacial adhesion. We have investigated the adhesion of model copper nanocubes on chemically treated aligned electrospun polyacrylonitrile (PAN) fibers based on the introduction of interfacial shear strains through mechanical deformation. The composite structures were subjected to distinct macroscopic tensile strain levels of 7%, 11%, and 14%.