The Polyol Process and the Synthesis of ζ Intermetallic Compound AgSn.

The present work concerns the intermetallic compound (IMC) existing in the Ag-Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound with the chemical formula AgSn belonging to the solid solution of composition located between 9 and 16 at.% Sn, known as solid solution ζ (or ζ-AgSn).