In this research, Cu-doped fluorohydroxyapatite (Cu-FHAp) coatings containing varying levels of Cu in electrolyte as a dopant were synthesized by the ultrasonic-assisted pulse-reverse electrodeposition method on AZ31 alloy to improve the biocompatibility and corrosion resistance of the alloy for biomedical applications. Microstructural analysis revealed that the inclusion of the Cu dopant results in the formation of a more uniform coating. Energy dispersive spectroscopy analysis highlights a notable incorporation of copper within the fluorohydroxyapatite structure.
View Article and Find Full Text PDFTitanium (Ti) has been widely used for manufacturing of bone implants because of its mechanical properties, biological compatibility, and favorable corrosion resistance in biological environments. However, Ti implants are prone to infection (peri-implantitis) by bacteria which in extreme cases necessitate painful and costly revision surgeries. An emerging, viable solution for this problem is to use copper (Cu) as an antibacterial agent in the alloying system of Ti.
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